NTZD5110N
PACKAGE DIMENSIONS
SOT?563, 6 LEAD
CASE 463A
ISSUE F
NOTES:
D
?X?
A
L
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6
5
4
MILLIMETERS
INCHES
1
2
3
E
?Y?
H E
DIM
A
b
MIN NOM MAX
0.50 0.55 0.60
0.17 0.22 0.27
MIN
0.020
0.007
NOM MAX
0.021 0.023
0.009 0.011
C
D
0.08 0.12 0.18
1.50 1.60 1.70
0.003
0.059
0.005 0.007
0.062 0.066
e
b 65 PL
0.08 (0.003)
M
X Y
C
E
e
L
1.10 1.20 1.30
0.5 BSC
0.10 0.20 0.30
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
H E
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
SCALE 20:1
inches
1.50 1.60 1.70
0.059 0.062 0.066
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NTZD5110N/D
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